pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor's 30-year legacy of technology advancements and strong IP portfolio but with a new mission-to enhance Murata's world-class capabilities with high-performance semiconductors. With a strong foundation in RF integration, pSemi's product portfolio now spans power management, connected sensors, optical transceivers, antenna tuning and RF frontends. These intelligent and efficient semiconductors enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices and healthcare. From headquarters in San Diego and offices around the world, pSemi's team explores new ways to make electronics for the connected world smaller, thinner, faster and better.

Job Summary

This position is responsible for all aspects of semiconductor packaging through all phases of product development which includes early concept feasibility, prototyping, product qualification, and production transition to production. The individual is fully conversant with microelectronics packaging technologies and has in-depth understanding of the interactions between manufacturing processes, verification testing, and quality assurance methodology. This individual represents the interests of packaging on cross functional engineering teams. This position must enjoy working in a fast-paced environment while maintaining a sense of commitment and be flexible to project needs. The position must be a team player and possess a sense of urgency to meet product requirements on schedule.

Roles & Responsibilities

This position has responsibility for:

* Independently responsible for design of bump, package, and assembly process flow for new products for use in high volume, high reliability, industrial, commercial, and automotive applications and will use data analysis to drive most decisions.
* Leads the development and maintenance of a forward-looking packaging roadmap and aligns with product line roadmaps and other technology roadmaps.
* Identifies new packaging technologies and or suppliers to facilitate and propel product line roadmaps in a highly competitive market landscape.
* Defines and develops manufacturing processes and documents process capabilities in the form of design rules for product development teams.
* Coordinates early concept sketches, technology recommendations, collects and reviews cost estimates in support of customer facing product opportunity pursuits.
* Assesses feasibility and guides a cross functional design team to make appropriate design decisions related to packaging and assembly processes for both prototype and high-volume manufacturing.
* Performs cost and risk assessments for new product designs against design rules and appropriately accommodates ambiguity.
* Detailed package design including the use of tolerance analysis and simulation tools to assess design integrity and performance for mechanical and thermal reliability as well as manufacturing producibility.
* Coordinates the preparation, review and approval of design documentation and bill of materials for both chip fabrication, backend wafer processes, and component assembly.
* Planning and oversite of DoE experiments collecting characterization data to substantiate design decisions and mitigate technical risk to new products in development.
* Directs internal support personnel and other key supply chain partners including wafer fabs, offshore assembly and test contractors, and 3rd party service providers with service needs for specific technology or product developments.
* Leadership in failure analysis and problem resolution in the development process or production environment
* Mentor senior engineers in all aspects of the packaging and assembly disciplines.

Competency Requirements

In order to perform the job successfully, an individual should demonstrate the following competencies:
* Driving for Results: Aggressively pursues challenging goals and objectives; will put in considerable time and effort to accomplish objectives; takes a highly focused, goal driven approach toward work
* Acting Decisively: Moves quickly to make decisions and commit to a clear course of action; comfortable making decisions based on partial information; willing to take risks in order to maintain momentum; shows a strong bias toward action.
* Acting as a Champion for Change: Challenges the status quo; encourages people to question existing methods, practices, and assumptions; supports people in their efforts to try new things
* Critical thinking: Skilled at finding logical flaws in arguments and plans; identifies problems and solutions that others might miss; provides detailed insight and constructive criticism into problems and complex situations
* Working with Ambiguity: Achieves forward progress in the face of poorly defined situations and/or unclear goals; able to work effectively with limited or partial information

Minimum Qualifications (Experience and Skills)

* Typically requires 12 years of experience in electronics packaging depending on education level and experience. Work experience must include a minimum of 5 years of hands-on experience in specific packaging technology discipline.
* Experience with package assembly process development for high volume commercial products.
* Understands chip design, material properties and interactions with manufacturing processes.
* Hands on experience with design tools such as AutoCAD and Cadence Allegro (or equivalent).
* Cross-functional team leadership.
* Demonstrated experience driving packaging technology developments.
* Experience working with offshore assembly suppliers.
* Understanding of the semiconductor supply chain management principles.
* Demonstrated experience with DOE methodology.
* Ability to present highly technical information to non-technical personnel.
* Demonstrated technical leadership and subject matter expertise in a specific packaging technology discipline.
* Familiarity with Microelectronic packaging technologies including flip chip bumping, wafer backend processing, SMT, flip chip attach, flux cleaning, overmold, package marking, dicing, test, and packaging for shipment.

Preferred Qualifications

* Experience with design of RF products.
* Experience with statistical analysis software/tools.
* Experience with Excel based macros and an aptitude for automating tasks.
* Experience with PCB fabrication processes and design.
* Hands on experience with Finite Element Analysis tools (Ansys).
* Understanding basic semiconductor quality and reliability requirements.
* Understanding package reliability and failure modes.

Education Requirements
* Bachelor's in Engineering (Packaging, Electrical, Mechanical, Materials or Chemical), Physics or Chemistry; MS preferred.

Work Environment
This job operates in a professional office environment. This role routinely uses standard office equipment.

Physical Demands
The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. While performing the duties of this job, the employee is regularly required to talk or hear. The employee frequently is required to stand; walk; use hands to finger, handle or feel; and reach with hands and arms. Specific vision abilities required by this job include close vision, distance vision, color vision, peripheral vision, depth perception and ability to adjust focus. This position requires the ability to occasionally lift office products and supplies, up to 20 pounds.

USD $172,201.96 - $223,874.95 per year

pSemi Corporation supports a diverse workforce and is committed to a policy of equal employment opportunity for applicants and employees. pSemi does not discriminate on the basis of age, race, color, religion (including religious dress and grooming practices), sex/gender (including pregnancy, childbirth, or related medical conditions or breastfeeding), gender identity, gender expression, genetic information, national origin (including language use restrictions and possession of a driver's license issued under Vehicle Code section 12801.9), ancestry, physical or mental disability, legally-protected medical condition, military or veteran status (including "protected veterans" under applicable affirmative action laws), marital status, sexual orientation, or any other basis protected by local, state or federal laws applicable to the Company. pSemi also prohibits discrimination based on the perception that an employee or applicant has any of those characteristics, or is associated with a person who has or is perceived as having any of those characteristics.

Note: The Peregrine Semiconductor name, Peregrine Semiconductor logoand UltraCMOS are registered trademarks and the pSemi name, pSemi logo, HaRP andDuNE are trademarks of pSemi Corporation in the U.S. and other countries. All other trademarks are the property of their respective companies. pSemi products are protected under one or more of the following U.S. Patents: http://patents.psemi.com